Commercialization of flexible, hybrid and printed electronics is on the rise in many key markets, from automotive to healthcare, with applications such as sensors, wearables and smart packaging becoming more commonplace. Printed Electronics Europe 2019, organized by IDTechEx, will be held April 10-11, 2019 in Berlin, and will focus on showing attendees the newest technologies and end uses.
 
With more than 200 exhibitors, 2500 attendees, 250 presentations and numerous products to check out, this year’s Printed Electronics Europe should have plenty for attendees to learn and see.
 
IDTechEx CEO Raghu Das said that he continues to see growth in the industry. Das noted that key growth markets include medical/healthcare, structural electronics in automotive, smart packaging, and RFID/IoT.
 
“It’s really encouraging to see good growth of the event, which I take as a sign of the industry continuing to grow,” added Das. “In particular, there are more and more attendees each year coming from industry – organizations seeking to learn more and to ultimately potentially implement printed electronics.”

Das pointed to a number of highlights for the upcoming conference.
 
“There will be strong coverage of healthcare, with wearable devices moving more into mainstream healthcare, to new form factors such as electronic skin patches to a range of emerging biosensors,” Das reported. “There is huge technology innovation in smart packaging. We have several companies presenting for the first time on their novel new smart packaging companies, through to others covering applications for smart packaging including Diageo, Schreiner and AB InBev.
 
“Flexible hybrid electronics received a lot of attention, but at our event, we have detailed sessions really going into the key challenges and how these are being addressed and the opportunity that awaits,” he added.
 
After an introduction by Das, the Cornerstone presentations will begin with a joint presentation by Dennis Hahn, project leader design for assembly for Airbus Operations GmbH, and Max Seissler, junior consultant/engineer for Altran Deutschland S.A.S. & Co., who will discuss “Applications for Printed Electronics in the Aviation Industry.”

Dr. Kitty Yeung, creative technologist and senior product manager, Microsoft, closes the Cornerstone session with  “Demands and Opportunities in the Tech-Fashion Industry.”

After the Cornerstone talks, the conference will head into eight concurrent sessions. In addition to Printed Electronics Europe 2019, there will be seven co-located programs that are interconnected in their own ways. This year’s shows include programs on 3D Printing Europe, Electric Vehicles: Everything is Changing Europe, Energy Storage Innovations Europe, Graphene Europe, Internet of Things (IoT) Applications Europe, Sensors Europe, and Wearables Europe.

Printed Electronics Europe 2019 features its own group of keynote talks. Das again leads off, followed by Michael Petersen, COO of Information Mediary Corporation, whose topic is “Real World Smart Packaging for Pharmaceuticals;” Sameh Dardona,  associate director, research & innovation at United Technologies Research Center, who will discuss “Printed and Embedded Advanced Asset Monitoring Sensors;” and Jonas Vandercruys, project manager/product development, AB InBev, who will focus on “Introducing Smart Packaging in an FMCG Company.”
 
Other major companies presenting at Printed Electronics Europe 2019 include FIAT Research Center, Continental, NSG Pilkington, Quest Integrated (Qi2), Panasonic. Google, Diageo, Bosch, Jabil, Qualcomm Life, IBM, Flex and Siemens, among others.
 
“The end users speaking this year are quite tremendous in terms of numbers, breadth and what they will be discussing,” Das said. “They include ABInBev, Diageo, Beko, Google, Samsung, Panasonic, Continental, Airbus, Altran, Microsoft, Fiat, MAS, Visionox, Schreiner and many more.”
 
For more information, contact Chris Clare at [email protected].